ifw Jena offers the separation of wafers to chips. A structured or non-structured wafer is separated into chips of any size with a wafer saw. The wafer is not separated fully so the chips can be detached from the wafer easily.

At ifw Jena we saw wafers up to 6 inches from the following materials

  • Silicon
  • Ceramics
  • Glass

Your Contact

Dr.-Ing. Thomas Schroeter +49 3641 204-113 Send e-mail