TLP-Bonding

Transient liquid phase bonding (TLPB) is a new joining technology combining diffusion welding and joining with solder materials. Here, the advantages of diffusion welding and brazing can be specifically combined in a single process. In the TLPB process, a metallic intermediate layer is used. In combination with a pressing force, joints can be produced that are two-dimensional and high-strength. The bond quality is comparable to a diffusion-welded joint. This opens up possibilities for applications in mechanical engineering, aerospace, novel energy storage concepts or high-performance electronics, where thermal loads and the resulting component functionalities, such as long and safe service life, are decisive target parameters.