Sintering & soft-soldering for low temperature applications
The aim of the project is to develop a production technology for flux-free soft soldering and sintering of mixed compounds of metal, ceramic and glass materials. The aim is to realize complex component applications from several different materials with high hermeticity, high strength and thermal shock resistance in the range of -196 °C to +200 °C.
Fields of application are vacuum and cryogenics, liquid gas transport, optoelectronics and laser technology.